Printed Circuit Board Words

PCB Protype, MOQ 1PCS, Delivery time fastest 1day

   CNC drilling, cutting edge, light painting, etching production process, only for less demanding customers, providing fast, cheap proofing services. No drilling metal plating, no character screen (single layer PCB can be printed in black silkscreen ), solder green oil, only suitable for the experiment, manual welding, can also be used to check for errors before production. Because no drilling metal plating, double panel vias problem Check "vias solution", or modify files, avoiding component pins and vias, shop may be able to modify the file, because vias can resolve threading welded at both ends, but if the pin element and vias, there may be elements blocked welding end less, so to avoid component pins and vias; pad line to be set a little rough, welding is best to use low-temperature solder (shop for sale ). Recommended not to do, of course, if a lot of your money, we do not oppose the demanding user is recommended to do the whole process. 16:30 hours before delivery traded at 22:00, 16:30, if the transaction had to be postponed until 22:00 the next day will delivery. Do not take different type in a panel.

Technical indicators are as follows:
Layers (maximum) 1-30
Panel type FR-4
The maximum size of 500mm X1100mm
Accuracy ± 0.2mm Dimensions
Thickness range of 0.40mm - 2.4mm
Thickness tolerances (t ≥ 0.8mm) ± 10%
Thickness tolerances (t <0.8mm) ± 10%
Media thickness 0.075mm - 5.00mm
The minimum width 6mil
Minimum spacing 6mil
35um thick outer layer of copper
Inner copper thickness 17um - 100um
Drilling aperture (ROP) 0.3mm - 6.35mm
Into the hole diameter (drilling) 0.3mm - 6.30mm
Diameter tolerance (ROP) 0.08mm
Diameter tolerance (ROP) 0.09mm
Thickness aperture ratio 8: 1
Solder type photographic ink
The minimum width of 0.1mm solder bridge

Sophie Deng
_______________________________________
Wonderful PCB Limited
NO.32A,Building NO.1, XianDaiC hengHuaTing,ChuangYeRoad|NanShan District,ShenZhen City 518054|  China  T +86-755-86229518-806 | F  +86 755 2607 3529|  e  wonderful08@wonderfulpcb.com |
w  www.wonderfulpcb.com  | Skype:wonderful-07   |                                                   
Welcome to our trading shows:
1.Booth: L32,Expo Electronic 2013,Apr.10-12th in CROCUS EXPO,Moscow,Russia
2.Booth: 11J36, HK Global sources  Apr.12-15th, 2013 Asia World-Expo, Hong Kong
3.Booth: 9J35, HK Global sources Oct.12-15th,2013 Asia World-Expo, Hong Kong
4.Booth: 70206, CES  2014  Jan,8th-11th in Las Vegas, USA

What is the Current Board

First, what is the current board, printed circuit boards and electronic products have become indispensable for the vast majority of the major components. Single, double-sided PCB manufacturing is in the substrate material - copper clad laminate (Copper- (2lad I.aminates, CCI) on selectively drilling, copper plating, copper plating, etching, etc. processing, to obtain the desired circuit pattern. Another multilayer printed circuit board manufacturing, but also within the core of thin copper-clad laminates as substrate, the conductive pattern layers and prepreg (Pregpr'eg) alternately laminated by a one-time bonding together to form a conductive pattern layer interconnect between three or more layers. Thus it can be seen as a substrate material in PCB manufacturing, either CCL or prepreg in the printed board plays a very important role. It has a conductivity, insulation and support three aspects of the function. PCB performance, quality, manufacturing workability, manufacturing cost, the manufacturing level, etc., depends largely on the substrate material.

Second, the development history of the substrate substrate material and production technology, has gone through half a century of development, the world's annual output has reached 290 million square meters, the development time by electronic machine products, semiconductor manufacturing technology, electrical installation technology, printed circuit board technology innovative development driven from CCL 1943 phenolic resin substrate made into practical since the beginning of the development of the substrate material very quickly. In 1959, Texas Instruments Inc. to produce the first integrated circuit, for printing board of a higher high-density assembly requirements, thus contributing to the plywood production. In 1961, the United States Hazeltine Corpot ation company successfully developed a metal vias technology law multilayer technology. 1977 resin, BT resin to achieve a industrial production, to the world and provides a multilayer development of new low Tg substrate material. 1990 IBM Japan announced a photosensitive resin as the insulating layer laminated multilayer technology law, in 1997, including laminated plywood, including high density multilayer interconnect technology to develop maturity. At the same time, in order to BGA, CSP is a typical representative of the plastic package substrate has been rapid development. Late, some of the free bromine, antimony and other new green flame retardant board is rising rapidly in the 1990s, to the market. Of the substrate material already 40 years of development, it has formed the production scale of about 90 billion yuan in output value. In 2000, China's mainland CCL production has reached 64 million square meters, the output value of 5.5 billion yuan. In which the paper-based CCL production has ranked third in the world. But in technology, product varieties, particularly the development of new substrate, with foreign advanced countries there are still a considerable gap.

Third, the classification of the general PCB board substrate materials can be divided into two categories: rigid substrate material and the flexible substrate material. Important species is generally rigid substrate materials CCL. It is the reinforcing material (Reinforeing Material), impregnated with resin adhesive, by drying, cutting, folding synthesis blank, then covered with foil, with steel as a mold, in a high temperature and pressure in a hot press forming in the system into. Multilayer prepreg general use, it is CCL semi-finished products in the production process (mostly glass cloth impregnated with resin, dried processed). There are several classifications of copper clad board. Usually by reinforcing material plate is different, it can be divided into: paper-based, glass fiber cloth, composite matrix (CEM series), laminated plywood base and specialty materials group (ceramics, metal core group, etc.) five categories. If you press the resin adhesive plate used to classify different common paper-based CCI. They are: various types of phenolic resin (XPc, XxxPC, FR a 1, FR-2, etc.), epoxy resin (FE-3), a polyester resin. Common glass fiber cloth CCL epoxy (FR-4, FR-5), which is a glass fiber cloth type most widely used. There are also other particularity resin (glass fiber cloth, poly amide fibers, non-woven material is increased): modified bismaleimide triazine resin (BT), polyimide resin (PI) , diphenylene ether resin (PPO), maleic anhydride imide - styrene resin (MS), polycyanate ester resin, a polyolefin resin or the like. CCL by flame retardant classification can be divided into flame retardant (UL94 a VO, UL94 a V1 level) and non-flame retardant (UL94 HB level a) two boards. Nearly two years, with more emphasis on environmental issues, the flame-retardant CCL CCL in turn branch breed a new bromine-free material, it can be called "green flame retardant cCL". With the rapid development of electronic products and technology, to cCL higher performance requirements. Therefore, the performance of CCL classification, divided into general performance CCL, low dielectric constant CCL, high heat resistance, CCL (general board of L at above 150 ℃), low thermal expansion coefficient of the CCL (generally used on the package substrate ) and other types.

PCB industry supplied by evergrande mode evolution continues to advance

1. PCB industry supplied by evergrande mode evolution continues to advance

Recently, the manufacturers of printed circuit board (PCB) TTMTechnologies, about $368 million in all acquisition huia group (Via systems) jointly create news of the kingdom of PCB manufacturing is terminal operators know, maybe 1 + 1 > 2 is the reason that the two bosses concern, integration of resources has become a popular vocabulary in this industry, however, whether this big mergers or through expansion of production capacity, we can't send out, PCB industries concurrently evergrande mode evolution is still in advance.

2. Taiwan PCB factory output value to achieve high growth strive to surpass Japan and South Korea this year

According to the personage inside course of study says, Taiwan PCB manufacturers TPT, plans to increase production to 150 square feet in 2014.The global notebook motherboard market share of 20% in 2013, plans this year to 25%.
Printed circuit board (PCB) industry is one of the earliest development of electronics industry in Taiwan, the history of more than 40 years, over the past few years a lot of the decline in PCB industry because of the PC industry, after 2008, wash dish and turn into the new electronic products such as mobile phone, tablet, plus international paper, several PCB industry to become the market this year big dark horse, including hin hing, clever, songstress China turn into profit, like electricity, etc, to say goodbye.
Engineering institute estimates, 2014 Taiwan PCB industry output growth of 2.66%, 533 billion Yuan on the output, and break the past three years, only about 1% of the low growth. Institute will MIC, high on the top three global PCB industry in Taiwan, output value of more is equal with Japan in recent years, surpassed Japan for the first time in 2011 in Taiwan, Taiwan industry output value accounted for 31%, Japan (29%), with their close HDI production line, Samsung important PCB supplier DAP in March, the fire supply tight, apple with the apple camp positive transfer list for Taiwan factory.

Multilayer flexible PCB

Multilayer PCB soft as rigid as a multilayer PCB, multilayer lamination technology, can be made into a multi-layer flexible PCB. The easiest multilayer soft-sided PCB PCB is covered with two layers of copper on both sides to form a shield of three soft PCB. This is equivalent to three soft PCB coaxial wire or shield wire on the electrical characteristics. The most common structure is a four-layer PCB multilayer flexible structure with metallized holes to achieve the interconnection between layers, the middle floor general is the power and ground planes.

Advantages multilayer PCB soft base film is lightweight and has excellent electrical characteristics, such as low dielectric constant. Multilayer flexible PCB board made of polyimide film to the substrate than the weight of rigid epoxy glass cloth multi-layer PCB board about 1/3 lighter, but it lost its single-sided, double-sided flexible PCB fine The flexible, most of these products are not required to be flexible.
Multilayer PCB soft can be further divided into the following types:

1) is formed on a flexible insulating substrate a multilayer PCB, which is defined as the finished product can flex: This structure is usually one or both sides of the microstrip many flexible PCB bonded to both surfaces of the end, but its center and bonding together the end portions, so as to have a high degree of flexibility. In order to have the desired electrical characteristics, such as characteristic impedance performance and rigid PCB interconnect it matches, each wire layer of the multilayer flexible PCB components, the design must be in ground contact surface of the signal line. In order to have a high degree of flexibility, the layer may be a thin wire, a suitable coating, such as polyimide, instead of a thick layer of laminated cover layer. Z metallized holes so that the surface between the flexible wiring layer may achieve the desired interconnection. This multi-layer flexible PCB best suited for applications requiring flexibility, high reliability and high density designs.

2) constituting the multilayer PCB in the flexible insulating substrate, the end of which the finished product can be predetermined deflection: These soft multi-layer flexible PCB is an insulating material, such as a polyimide film, a laminate made of plywood. After lamination losing inherent flexibility. When the design requirements to maximize the use of the insulating film properties, such as low dielectric constant, the thickness of the homogeneous medium, light weight and capable of continuously processing characteristics, on the use of such a flexible PCB. For example, a polyimide film with a multilayer PCB insulating material about epoxy glass cloth weight is lighter than the third rigid PCB.

3) constituting the multilayer PCB in the flexible insulating base material, the finished product must be shaped, rather than continuous flexing: These soft multi-layer PCB is formed of a soft insulating material. Although it uses a soft material, but due to restrictions of the electrical design, as for the required conductor resistance, require a thick conductor, or for the desired impedance or capacitance, between the request signal layer and the ground layer has a thickness The insulating spacer, therefore, it is applied when the finished product has been formed. The term "formable" is defined as: a multi-layer flexible PCB member has the ability to make a desired shape, and in the application can not be deflected. Application avionics unit internal wiring. In this case, the requirements of the stripline conductor or three-dimensional design of low resistance, capacitive coupling or circuit noise and minimal interconnection end portion can be smoothly curved in a 90 °. Multilayer PCB soft polyimide film material implements this routing tasks. Because high temperature polyimide film, there are flexible, and good overall electrical and mechanical characteristics. To achieve this all the interconnecting member section, wherein the alignment portion is further divided into a plurality of multi-layer flexible circuit member, and together with the adhesive tape to form a printed wiring bundle.