After the printed circuit board (PCB) is completed, electronic components must be attached to form a functional printed circuit assembly, or PCA (sometimes called a "printed circuit board assembly" PCBA). In through-hole construction, component leads are inserted in holes. In surface-mount (SMT - surface mount technology) construction, the components are placed on pads or lands on the outer surfaces of the printed circuit board. In both kinds of construction, component leads are electrically and mechanically fixed to the board with a molten metal solder.
There are a variety of soldering techniques used to attach components to a PCB board. High volume production is usually done with SMT placement machine and bulk wave soldering or reflow ovens, but skilled technicians are able to solder very tiny parts (for instance 0201 packages which are 0.02 in. by 0.01 in.) by hand under a microscope, using tweezers and a fine tip soldering iron for small volume prototypes. Some parts may be extremely difficult to solder by hand, such as BGA packages.
Often, through-hole and surface-mount construction must be combined in a single assembly because some required components are available only in surface-mount packages, while others are available only in through-hole packages. Another reason to use both methods is that through-hole mounting can provide needed strength for components likely to endure physical stress, while components that are expected to go untouched will take up less space using surface-mount techniques.
After the board has been populated it may be tested in a variety of ways. Because of those test, printed circuit board may be designed with extra pads to make temporary connections. Sometimes these pads must be isolated with resistors. The in-circuit test may also exercise boundary scan test features of some components. In-circuit test systems may also be used to program nonvolatile memory components on the PCB board.
In boundary scan testing, test circuits integrated into various ICs on the board form temporary connections between the PCB board traces to test that the ICs are mounted correctly. Boundary scan testing requires that all the ICs to be tested use a standard test configuration procedure, the most common one being the Joint Test Action Group (JTAG) standard. The JTAG test architecture provides a means to test interconnects between integrated circuits on a board without using physical test probes. JTAG tool vendors provide various types of stimulus and sophisticated algorithms, not only to detect the failing nets, but also to isolate the faults to specific nets, devices, and pins.
When PCB board fail the test, technicians may desolder and replace failed components, a task known as rework.
Have you ever do PCB assembly all by yourself? Well, I have.
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