2015年6月18日星期四

Do PCBA Project By Yourselves - DIY PCB

PCBA ( WDF-PCBA-20 ) - wonderfulpcb.com

Do you want to finish a “big” project by yourself?

Do you want to take the full advantage of your old radio, old phone, old clock, even your old electronic toy given at your sixth birthday!

Do you want to use those “old histories” to create “a new miracle”?

To use these spare parts to do assembly, to finish a PCBA project, to make it a new device that you’d be interested in. Then please follow with me.

An old radio hacked into an iPhone dock

This is a PCBA project I did that was really cool to make. I took an old radio of my father, and modified it so that it became an iPhone dock. It was actually a pretty simple project to do.

I used spare parts that I had in my house, including an Arduino, an old speaker, a simple amplifier and some LEDs.

Very simple stereo amplifier

I like this PCBA project because it is a fully functional stereo amplifier with only a few components required. After I finishes it, I set it on my computer, it worked pretty well.

For a long time I wanted to build an amplifier, but I never got to it because the projects either needed a preamplifier, seemed too complicated or was mono only.

Then one day I came across an article describing how to make a stereo amplifier circuit using the TEA2025 and some resistors and capacitors. It was a very simple electronic circuit to build and I finished it on a strip board in only a few hours.

WiFi Radio

The WiFi Radio is a really well done project. As you can see in the link below, the result is a really beautiful radio.

This project is actually easier to do now after the Raspberry Pi was released. And also much cheaper. Linux can easily be installed on the Raspberry Pi and it already has a built-in sound card. You also don’t need a dedicated microcontroller for the LCD if you use a Raspberry Pi.

Charming DIY ideas, right? Then let’s move!

2015年6月2日星期二

The assembly of printed circuit board


After the printed circuit board (PCB) is completed, electronic components must be attached to form a functional printed circuit assembly, or PCA (sometimes called a "printed circuit board assembly" PCBA). In through-hole construction, component leads are inserted in holes. In surface-mount (SMT - surface mount technology) construction, the components are placed on pads or lands on the outer surfaces of the printed circuit board. In both kinds of construction, component leads are electrically and mechanically fixed to the board with a molten metal solder.

There are a variety of soldering techniques used to attach components to a PCB board. High volume production is usually done with SMT placement machine and bulk wave soldering or reflow ovens, but skilled technicians are able to solder very tiny parts (for instance 0201 packages which are 0.02 in. by 0.01 in.) by hand under a microscope, using tweezers and a fine tip soldering iron for small volume prototypes. Some parts may be extremely difficult to solder by hand, such as BGA packages.

Often, through-hole and surface-mount construction must be combined in a single assembly because some required components are available only in surface-mount packages, while others are available only in through-hole packages. Another reason to use both methods is that through-hole mounting can provide needed strength for components likely to endure physical stress, while components that are expected to go untouched will take up less space using surface-mount techniques.

After the board has been populated it may be tested in a variety of ways. Because of those test, printed circuit board may be designed with extra pads to make temporary connections. Sometimes these pads must be isolated with resistors. The in-circuit test may also exercise boundary scan test features of some components. In-circuit test systems may also be used to program nonvolatile memory components on the PCB board.

In boundary scan testing, test circuits integrated into various ICs on the board form temporary connections between the PCB board traces to test that the ICs are mounted correctly. Boundary scan testing requires that all the ICs to be tested use a standard test configuration procedure, the most common one being the Joint Test Action Group (JTAG) standard. The JTAG test architecture provides a means to test interconnects between integrated circuits on a board without using physical test probes. JTAG tool vendors provide various types of stimulus and sophisticated algorithms, not only to detect the failing nets, but also to isolate the faults to specific nets, devices, and pins.

When PCB board fail the test, technicians may desolder and replace failed components, a task known as rework.

2015年5月12日星期二

Printed Circuit Board Words

PCB Protype, MOQ 1PCS, Delivery time fastest 1day

   CNC drilling, cutting edge, light painting, etching production process, only for less demanding customers, providing fast, cheap proofing services. No drilling metal plating, no character screen (single layer PCB can be printed in black silkscreen ), solder green oil, only suitable for the experiment, manual welding, can also be used to check for errors before production. Because no drilling metal plating, double panel vias problem Check "vias solution", or modify files, avoiding component pins and vias, shop may be able to modify the file, because vias can resolve threading welded at both ends, but if the pin element and vias, there may be elements blocked welding end less, so to avoid component pins and vias; pad line to be set a little rough, welding is best to use low-temperature solder (shop for sale ). Recommended not to do, of course, if a lot of your money, we do not oppose the demanding user is recommended to do the whole process. 16:30 hours before delivery traded at 22:00, 16:30, if the transaction had to be postponed until 22:00 the next day will delivery. Do not take different type in a panel.

Technical indicators are as follows:
Layers (maximum) 1-30
Panel type FR-4
The maximum size of 500mm X1100mm
Accuracy ± 0.2mm Dimensions
Thickness range of 0.40mm - 2.4mm
Thickness tolerances (t ≥ 0.8mm) ± 10%
Thickness tolerances (t <0.8mm) ± 10%
Media thickness 0.075mm - 5.00mm
The minimum width 6mil
Minimum spacing 6mil
35um thick outer layer of copper
Inner copper thickness 17um - 100um
Drilling aperture (ROP) 0.3mm - 6.35mm
Into the hole diameter (drilling) 0.3mm - 6.30mm
Diameter tolerance (ROP) 0.08mm
Diameter tolerance (ROP) 0.09mm
Thickness aperture ratio 8: 1
Solder type photographic ink
The minimum width of 0.1mm solder bridge

Sophie Deng
_______________________________________
Wonderful PCB Limited
NO.32A,Building NO.1, XianDaiC hengHuaTing,ChuangYeRoad|NanShan District,ShenZhen City 518054|  China  T +86-755-86229518-806 | F  +86 755 2607 3529|  e  wonderful08@wonderfulpcb.com |
w  www.wonderfulpcb.com  | Skype:wonderful-07   |                                                   
Welcome to our trading shows:
1.Booth: L32,Expo Electronic 2013,Apr.10-12th in CROCUS EXPO,Moscow,Russia
2.Booth: 11J36, HK Global sources  Apr.12-15th, 2013 Asia World-Expo, Hong Kong
3.Booth: 9J35, HK Global sources Oct.12-15th,2013 Asia World-Expo, Hong Kong
4.Booth: 70206, CES  2014  Jan,8th-11th in Las Vegas, USA

2015年5月7日星期四

Tips for PCBs and PCBAs Design



WHAT SHOULD I KNOW AND EXPECT? 
Successful CAD/CAM data transfer depends on data integrity and continuity. Data may originate from multiple sources and be stored in a variety of places throughout the process. Very strict conventions and data definitions are required. The pick and place CAD/CAM interface is relatively simple. It requires the designer to establish a useable coordinate system during the layout of the PCBA then merge the coordinates with the BOM and reference designators. Many of the popular layout tools have this feature built in. CAM uses automated equipment to handle and align the PCBAs. This automated equipment requires the use of alignment marks or “fiducials”. Some PCB fabricators will add the fiducials automatically, some will not. Therefore, it is always best for the designer to add the fiducial marks and export their coordinates along with the component coordinates. 

Data fields 
The following data fields must be exported in the following order into a single tab delimited file: 
1) Reference Designator (ie: “R1”, “R2”, “C1”, “U1”, etc) 
2) A unique part number. This is the VERGENT PRODUCTS part number for turnkey products. 
3) Description of the unique part number (ie: “RES, 10K 1% 1/10W 0603”) 
4) Board side for the given reference designator. This will be one of two values: 
“T” for component side or top. “B” for circuit side or bottom. 
5) X Coordinate in mills 
6) Y Coordinate in mills 
7) Orientation in degrees (ie: “0”, “90”, “180”, “270”) 
8) Polarity flag. This will be one of two values: 
“”Y” for components that are polarity sensitive. (ie: Diodes, LED’s, IC’s) 
“N” for components that do not matter. (ie: Resistors, certain capacitors) 
A sample file is given in Appendix A. 

PCBA Fiducials 
PCBA should be designed with at least two 50 mill round fiducials. 
The fiducials should be spaced as far apart as possible but within .250” from board edges. 
The solder mask must be clear over the top of the fiducial. Fiducials should be identified using the part number “FIDUCIAL” and a unique reference designator. 

Component labels 
To ensure data integrity the labels on all part containers must match the BOM exactly. Abbreviations shall not be used. 

Component presentation 
The presentation of a component (reel, tube, tray, other) is critical to automation. If a component is presented in a different manner then the machine program must be changed each time. Where possible standardize on a particular presentation and enforce it in your BOM.

Cut tape 
If components are inexpensive consider purchasing an entire reel as opposed to cut tape. While the cut tape may appear less expensive on the surface it can result in significant delays and costs overruns. Here is a real example for a 10K ohm 0603 resistor: 
Cut tape: 10 strips of 10 at $.70 each. Price: $ 7.00. 
Reel: 5000 parts. Price: $15.60. 
The reality is quite different because it takes time to handle and manage the cut tape: 
Cut tape cost: $ 7.00 parts + $17.00 handling + $104.00 feeder setup = $128.00 
Reel cost: $ 15.60 parts + $ 1.70 handling + $ 10.40 Feeder setup = $27.70 
Sometimes the component cost makes purchasing a reel prohibitive. In that case VERGENT PRODUCTS recommends purchasing a minimum of 100 pieces or the quantity required plus 20% in a contiguous strip. 

Silkscreen 
Reference designators should be places on the silk screen along with very clear polarity markings using IPC industry standards. 

Do Not Load (DNL) 
Components that have reference designators or a place to be loaded but will not be loaded must be clearly identified on the BOM. The nomenclature used in the industry is “DNL” for the part number. VERGENT PRODUCTS strongly recommends that all reference designators have part numbers assigned including the DNL. 
VERGENT PRODUCTS has assigned the part number 999-99-99999 as the dummy part number for DNL. 

2015年5月6日星期三

What is the Current Board



First, what is the current board, printed circuit boards and electronic products have become indispensable for the vast majority of the major components. Single, double-sided PCB manufacturing is in the substrate material - copper clad laminate (Copper- (2lad I.aminates, CCI) on selectively drilling, copper plating, copper plating, etching, etc. processing, to obtain the desired circuit pattern. Another multilayer printed circuit board manufacturing, but also within the core of thin copper-clad laminates as substrate, the conductive pattern layers and prepreg (Pregpr'eg) alternately laminated by a one-time bonding together to form a conductive pattern layer interconnect between three or more layers. Thus it can be seen as a substrate material in PCB manufacturing, either CCL or prepreg in the printed board plays a very important role. It has a conductivity, insulation and support three aspects of the function. PCB performance, quality, manufacturing workability, manufacturing cost, the manufacturing level, etc., depends largely on the substrate material.

Second, the development history of the substrate substrate material and production technology, has gone through half a century of development, the world's annual output has reached 290 million square meters, the development time by electronic machine products, semiconductor manufacturing technology, electrical installation technology, printed circuit board technology innovative development driven from CCL 1943 phenolic resin substrate made into practical since the beginning of the development of the substrate material very quickly. In 1959, Texas Instruments Inc. to produce the first integrated circuit, for printing board of a higher high-density assembly requirements, thus contributing to the plywood production. In 1961, the United States Hazeltine Corpot ation company successfully developed a metal vias technology law multilayer technology. 1977 resin, BT resin to achieve a industrial production, to the world and provides a multilayer development of new low Tg substrate material. 1990 IBM Japan announced a photosensitive resin as the insulating layer laminated multilayer technology law, in 1997, including laminated plywood, including high density multilayer interconnect technology to develop maturity. At the same time, in order to BGA, CSP is a typical representative of the plastic package substrate has been rapid development. Late, some of the free bromine, antimony and other new green flame retardant board is rising rapidly in the 1990s, to the market. Of the substrate material already 40 years of development, it has formed the production scale of about 90 billion yuan in output value. In 2000, China's mainland CCL production has reached 64 million square meters, the output value of 5.5 billion yuan. In which the paper-based CCL production has ranked third in the world. But in technology, product varieties, particularly the development of new substrate, with foreign advanced countries there are still a considerable gap.

Third, the classification of the general PCB board substrate materials can be divided into two categories: rigid substrate material and the flexible substrate material. Important species is generally rigid substrate materials CCL. It is the reinforcing material (Reinforeing Material), impregnated with resin adhesive, by drying, cutting, folding synthesis blank, then covered with foil, with steel as a mold, in a high temperature and pressure in a hot press forming in the system into. Multilayer prepreg general use, it is CCL semi-finished products in the production process (mostly glass cloth impregnated with resin, dried processed). There are several classifications of copper clad board. Usually by reinforcing material plate is different, it can be divided into: paper-based, glass fiber cloth, composite matrix (CEM series), laminated plywood base and specialty materials group (ceramics, metal core group, etc.) five categories. If you press the resin adhesive plate used to classify different common paper-based CCI. They are: various types of phenolic resin (XPc, XxxPC, FR a 1, FR-2, etc.), epoxy resin (FE-3), a polyester resin. Common glass fiber cloth CCL epoxy (FR-4, FR-5), which is a glass fiber cloth type most widely used. There are also other particularity resin (glass fiber cloth, poly amide fibers, non-woven material is increased): modified bismaleimide triazine resin (BT), polyimide resin (PI) , diphenylene ether resin (PPO), maleic anhydride imide - styrene resin (MS), polycyanate ester resin, a polyolefin resin or the like. CCL by flame retardant classification can be divided into flame retardant (UL94 a VO, UL94 a V1 level) and non-flame retardant (UL94 HB level a) two boards. Nearly two years, with more emphasis on environmental issues, the flame-retardant CCL CCL in turn branch breed a new bromine-free material, it can be called "green flame retardant cCL". With the rapid development of electronic products and technology, to cCL higher performance requirements. Therefore, the performance of CCL classification, divided into general performance CCL, low dielectric constant CCL, high heat resistance, CCL (general board of L at above 150 ℃), low thermal expansion coefficient of the CCL (generally used on the package substrate ) and other types.

2015年5月5日星期二

PCB industry supplied by evergrande mode evolution continues to advance

1. PCB industry supplied by evergrande mode evolution continues to advance

Recently, the manufacturers of printed circuit board (PCB) TTMTechnologies, about $368 million in all acquisition huia group (Via systems) jointly create news of the kingdom of PCB manufacturing is terminal operators know, maybe 1 + 1 > 2 is the reason that the two bosses concern, integration of resources has become a popular vocabulary in this industry, however, whether this big mergers or through expansion of production capacity, we can't send out, PCB industries concurrently evergrande mode evolution is still in advance.

2. Taiwan PCB factory output value to achieve high growth strive to surpass Japan and South Korea this year

According to the personage inside course of study says, Taiwan PCB manufacturers TPT, plans to increase production to 150 square feet in 2014.The global notebook motherboard market share of 20% in 2013, plans this year to 25%.
Printed circuit board (PCB) industry is one of the earliest development of electronics industry in Taiwan, the history of more than 40 years, over the past few years a lot of the decline in PCB industry because of the PC industry, after 2008, wash dish and turn into the new electronic products such as mobile phone, tablet, plus international paper, several PCB industry to become the market this year big dark horse, including hin hing, clever, songstress China turn into profit, like electricity, etc, to say goodbye.
Engineering institute estimates, 2014 Taiwan PCB industry output growth of 2.66%, 533 billion Yuan on the output, and break the past three years, only about 1% of the low growth. Institute will MIC, high on the top three global PCB industry in Taiwan, output value of more is equal with Japan in recent years, surpassed Japan for the first time in 2011 in Taiwan, Taiwan industry output value accounted for 31%, Japan (29%), with their close HDI production line, Samsung important PCB supplier DAP in March, the fire supply tight, apple with the apple camp positive transfer list for Taiwan factory.

2015年4月22日星期三

Single Layer PCB

Single-sided printed circuit board is in the early 1950s with the emergence of the transistor, developed by the United States as the center of the product, which were mainly copper production methods to direct etching method for the mainstream. From 1953 to 1955, Japan's imports of copper for the first time made ​​use of paper phenol copper foil substrate, and a large number of applications on the radio on. In 1956, Japan's professional circuit board manufacturer appears, and then a single panel manufacturing technology progresses rapidly. In material terms, early in paper phenol copper foil substrate mainly because of the phenol material was low electrical insulation, heat resistance welding, twisting and other factors, there is another paper ring gas resin, fiberglass epoxy resin and other materials to be development, the current consumer electronic equipment required for single-sided, almost phenol substrates using paper plates.

Printed circuit board with copper on only one side. Generally with the through-hole technology, the copper in the solder side, opposite to any component placement. All through holes will be Non-plated. Pad should be large enough to provide mechanical support part of the leadership. Pad is too small can be easily torn from the PCB board. And the copper layer surface mount technology components, or areas where the top plate.

In order to avoid your work was shelved, use a text label your copper layer. This simple addition will avoid confusion about orientation of the copper and drill files. If you are in the component side copper layer, and the assembly on the top of the board design, the text should be the correct reading. If the copper layer is the bottom, opposite your component, the text should leave the reading (reversed) looked through the plate.